Course Description

Anyone who wants to renew their IPC 7711/21 Instructor Certification must take this two (2) day IPC 7711/21 Instructor Certification. To maintain your 24-month certification, you must re-certify before your certification expires. This course provides hands-on experience with rework, repair, and modification, as well as a review of rework, repair, and modification rules.

A certificate must be renewed every 24 months. IPC 7711/21 Instructor Certification can complete a recertification Training Course within six months before the expiration of the certificate.


After completing the Course, students will take open book written examinations and be required to perform acceptable rework and repairs based on IPC-7711/7721. A student who successfully completes this Course is rewarded with an IPC 7711/7721 Certified IPC Instructor Certification that stays Valid for Two(2) Years. Students who have previously earned their Certified IPC Instructor Certification (CIT) certification within the last two years may take part in a relevant recertification course/ training.

Who this course is for

  • Anyone who wishes to renew their IPC certificate and is currently designated as a Certified IPC Trainer (CIT) with a valid certificate.

Reassembling printed circuit boards to their original drawings is a popular repair task. The IPC-7711 is designed for this purpose. It is used to restore PCB drawings to original specifications.

The IPC-7721 was created for the purpose of restoring a board’s functional competence – Made for fixing panels—restoring their operational capability. Course modules may be taken individually for those seeking certification in Component Rework (IPC-7711) or Board Repair (IPC-7721). Please contact us for more details.


Module 1 – IPC-7711 / 7721C Introduction and Common Procedures (Mandatory)

All other parts of the IPC-7711/7721C must also be covered by this mandatory Module. To be certified to additional knowledge modules, this module must be successfully completed before proceeding to any other knowledge modules.

  • Basic skills required to repair and rework circuit boards
  • Skill levels needed
  • Level of conformance the finished product will need to achieve Copy
  • Common terminology used.

Module 2 Workmanship – Wire Splicing

The workmanship of Wire Splicing requires the basic skills this additional knowledge module contains.

  • The Process of Wire Splicing
  • The Four Most Common Splices Mesh, Wrap, Hook, & Lap
  • Feasibility of Repair
  • Insulated Conductor Stripping
  • Tinning methods
  • Soldering
  • Procedures 8.1.1 – 8.1.4
  • Splice acceptance criteria

Module 3 Workmanship – Conformal Coating

The basic competencies required for Conformal Coating work are covered in this additional knowledge module.

  • Procedure 2.3.1, Coating Removal, Identification of Conformal Coating
  • Procedure 2.3.2, Coating Removal, Solvent Method
  • Procedure 2.3.3, Coating Removal, Peeling Method
  • Procedure 2.3.4, Coating Removal, Thermal Method
  • Procedure 2.3.5, Coating Removal, Grinding/Scraping Method
  • Procedure 2.3.6, Coating Removal, Micro Blasting Method
  • Procedure 2.4.1, Coating Replacement, Solder Resist
  • Procedure 2.4.2, Coating Replacement, Conformal Coating/ Encapsulants
  • Procedure 2.5, Baking and Preheating

Module 4 Workmanship – Through Hole Components

The basic skills required for Through Hole Component workmanship are contained in this additional knowledge module.

  • Procedure 3.1.1, Through-Hole Desoldering, Continuous Vacuum
  • Procedure 3.1.2, Through-Hold Desoldering, Continuous Vacuum – Partial Clinch
  • Procedure 3.1.3, Through-Hole Desoldering, Continuous Vacuum – Full Clinch Procedure
  • 3.1.4, Through-Hole Desoldering, Full Clinch Straightening
  • Procedure 3.1.3, Through-Hole Desoldering, Full Clinch Wicking
  • Installation of Through-Hole components, Tinning, Lead Forming, Soldering

Module 5 Workmanship – Chip and MELF Components

The basic knowledge required for Chip and MELF Component workmanship is contained in this additional knowledge module.

  • Procedure 3.3.1, Chip Component Removal – Bifurcated Tip
  • Procedure 3.3.2, Chip Component Removal – Tweezer Method
  • Procedure 3.3.3, Chip Component Removal – Hot Air Method
  • Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
  • Procedure 4.1.3, Surface Solder Removal – Braid Method
  • Procedure 5.3.1, Chip Installation – Solder Paste Method/Hot Air Pencil
  • Procedure 5.3.2, Chip Installation – Point to Point

Module 6 Workmanship – Gull Wing Lead Components

The basic knowledge required for workmanship on Gull Wing Lead Components is contained in this additional knowledge module.

  • Procedure 3.5.1, SOT Removal – Flux Application Method
  • Procedure 3.5.2, SOT Removal – Flux Application Method –Tweezer
  • Procedure 3.5.3, SOT Removal – Hot Air Pencil
  • Procedure 3.6.2, Gull Wing Removal (two-sided) – Solder wrap Method
  • Procedure 3.6.6, Gull Wing Removal (two-sided) – Tweezer
  • Procedure, Gull Wing Removal (four-sided) – Bridge Fill Method – Surface Tension
  • Procedure 3.7.7, Gull Wing Removal (four-sided) – Hot Gas
  • Procedure 3.7.1, Gull Wing Removal (four-sided) – Bridge Fill Method
  • Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
  • Procedure 4.1.2, Surface Mount Land Preparation – Continuous Method
  • Procedure 4.1.3, Surface Solder Removal – Braid Method
  • Procedure 4.4.1, Cleaning SMT Lands – Using Blade Tip and Solder Braid
  • Procedure 4.2.1, Pad Releveling – Using Blade Tip
  • Procedure 4.3.1, SMT Land Tinning – Using the Blade Tip
  • Procedure 5.5.1, Gull Wing Installation – Multi-Lead Method – Top of Lead
  • Procedure 5.5.3, Gull Wing Installation – Point-to-Point Method
  • Procedure 5.5.4, Gull Wing Installation – Hot Air Pencil/Solder Paste Method

Module 7 Workmanship – J-Lead Components

The basic knowledge required for working with J-Lead Components is contained in this additional knowledge module.

  • Procedure, J-Lead Removal – Bridge Fill Method – Surface Tension
  • Procedure 3.8.2, J-Lead Removal – Solder Wrap Method – Tweezer
  • Procedure 3.8.3, J-Lead Removal Flux Application Method – Tweezer
  • Procedure 3.8.4, J-Lead Removal – Flux & Tin Tip Only
  • Procedure 3.8.5, J-Lead Removal – Hot Gas Reflow System
  • Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
  • Procedure 4.1.2, Surface Mount Land Preparation – Continuous Method
  • Procedure 4.1.3, Surface Solder Removal, Braid Method
  • Procedure 5.6.1, J-Lead Installation – Solder Wire Method
  • Procedure 5.6.2, J-Lead Installation – Point-to-Point
  • Procedure 5.6.3, J-Lead Installation – Solder Paste/Hot Air

Module 9 Workmanship – Laminate Repair

This additional knowledge module provides the necessary basics for laminate repair work.

  • Procedure 3.3.1, Hole Repair, Epoxy Method
  • Procedure 3.3.2 Hole Repair, Transplant Method
  • Procedure 3.5.1, Base Material Repair, Epoxy Method
  • Procedure 2.6, Epoxy Mixing and Handling

Module 10 Workmanship – Circuit Repair

The additional knowledge module contains the basic skills necessary for Circuit Repair workmanship.

  • Procedure 4.2.1, Conductor Repair, Foil Jumper Epoxy Method
  • Procedure 4.2.2, Conductor Repair, Foil Jumper, Film Adhesive Method
  • Procedure 4.7.1, Surface Mount Pad Repair, Epoxy Method
  • Procedure 5.1, Plated Hole Repair, No Inner Layer Connection
  • Procedure 6.1, Jumper Wires
  • Procedure 2.6, Epoxy Mixing and Handling

Instructor Skills

The information presented in this module is designed to help you teach the lesson plan effectively.

  • How to properly convey the lesson plan step by step including presentation and guiding in correct direction.


On-Site training

If you want to reduce the time spent away from the office, traveling, and the cost of sending people to the class, On-Site Training may be for you. But, this might only be cost-effective for several people. We are not limited to just one type of training, at Ectrotec Training we have both on-site and training centers. Please contact our business support team for details on student quantity and material discounts.


If you have at least five people or want to bring in an open enrollment class in your region or country, Please Contact our Business Support Team for a personal discount. And you will surely be receiving some freebies.

Who we are

EctroTech is one of the largest training centres for the electronics industry in Europe, providing technical training and support for the manufacturing industry to quality people with quality that’s unbeatable. Our clients operate across various industries, including telecommunications, saleable electronics, automotive, protection and security, automotive, railroad, aviation and space, oil and gas, medical, life support, and more. With over more than 25+ years of experience in the manufacturing, testing, and quality inspection of various high ticket industries like Military, Medical, Aerospace, Aircraft, and Commercial electronics and more. From inspection services to ESD services, consultancy, training services and more, we have a wide range of products and services.Content-based open courses are not only customisable, but also engaging and informative. Customised training, on the other hand, are specifically designed to meet your learning demands. The recognition of the training is also high, so the effect will be optimal. We provide training materials, knowledge/skill assessments, solder training kits, IPC materials, and more to help your manufacturing operations succeed.