CERTIFICATION IPC 7711/7721 CERTIFIED IPC SPECIALIST (CIS)

IPC 7711 7721 Certification & Recertification Training Course

Course Description

The IPC-7711/7721 is the industry’s standard for regulating surface-mount component removal and repair procedures, regardless of the work involved in board replacement or surface-mount rework.
The module rework guide provides hands-on instruction and training on specific module rework, repair, and modification procedures. Students must be able to rework, repair and modify acceptable artistry samples.

Students can start with the most common modules and build upon their certification using other modules as needed. Anyone responsible for the quality and reliability of reworked or repaired electronic assemblies must take this four (4) day advanced course.

Certification

After completing the Course, students will take open book written examinations and be required to perform acceptable rework and repairs based on IPC-7711/7721. A student who successfully completes this Course is rewarded with an IPC 7711/7721 Certified IPC Specialist Certification that stays Valid for Two(2) Years. Students who have previously earned their Certified IPC Specialist (CIS) certification within the last two years may take part in a relevant recertification course/ training..

Who this course is for

  • PCB technicians who are responsible for reworking, repairing, or modifying assembled PCBs:
    • Repair engineers
    • Rework operators
    • Production Staff
    • Anyone who manages the quality and consistency of products leaving the firm.
  • Experience is required for attendees.

Reassembling printed circuit boards to their original drawings is a popular repair task. The IPC-7711 is designed for this purpose.
It is used to restore PCB drawings to original specifications.

The IPC-7721 was created for the purpose of restoring a board’s functional competence – Made for fixing panels—restoring their operational capability.

Course modules may be taken individually for those seeking certification in Component Rework (IPC-7711) or Board Repair (IPC-7721). Please contact us for more details.

Curriculum:

Module 1 – IPC-7711 / 7721C Introduction and Common Procedures (Mandatory)

This compulsory Module contains broad content, which is normally implied to all other section of the IPC-7711/7721C course. To obtain certification to additional knowledge modules, this module must be successful completed before it can be taken.

  • Basic skills required to repair and rework circuit boards
  • Skill levels needed
  • Level of conformance the finished product will need to achieve
  • Common terminology used.

Module 2 Workmanship – Wire Splicing

The workmanship of Wire Splicing requires the basic skills this additional knowledge module contains.

  • The Process of Wire Splicing
  • The Four Most Common Splices Mesh, Wrap, Hook, & Lap
  • Feasibility of Repair
  • Insulated Conductor Stripping
  • Tinning methods
  • Soldering
  • Procedures 8.1.1 – 8.1.4
  • Splice acceptance criteria

Module 3 Workmanship – Conformal Coating

The basic and additional knowledge required for Conformal Coating workmanship is contained in this additional knowledge module.

  • Procedure 2.3.1, Coating Removal, Identification of Conformal Coating
  • Procedure 2.3.2, Coating Removal, Solvent Method
  • Procedure 2.3.3, Coating Removal, Peeling Method
  • Procedure 2.3.4, Coating Removal, Thermal Method
  • Procedure 2.3.5, Coating Removal, Grinding/Scraping Method
  • Procedure 2.3.6, Coating Removal, Micro Blasting Method
  • Procedure 2.4.1, Coating Replacement, Solder Resist
  • Procedure 2.4.2, Coating Replacement, Conformal Coating/ Encapsulants
  • Procedure 2.5, Baking and Preheating

Module 4 Workmanship – Through Hole Components

The basic and additional knowledge required for Through Hole Components workmanship is provided in this additional knowledge module.

  • Procedure 3.1.1, Through-Hole Desoldering, Continuous Vacuum
  • Procedure 3.1.2, Through-Hold Desoldering, Continuous Vacuum – Partial Clinch
  • Procedure 3.1.3, Through-Hole Desoldering, Continuous Vacuum – Full Clinch Procedure
  • 3.1.4, Through-Hole Desoldering, Full Clinch Straightening
  • Procedure 3.1.3, Through-Hole Desoldering, Full Clinch Wicking
  • Installation of Through-Hole components, Tinning, Lead Forming, Soldering

Module 5 Workmanship – Chip and MELF Components

The basic and additional knowledge required for Chip and MELF Component workmanship is contained in this additional knowledge module.

  • Procedure 3.3.1, Chip Component Removal – Bifurcated Tip
  • Procedure 3.3.2, Chip Component Removal – Tweezer Method
  • Procedure 3.3.3, Chip Component Removal – Hot Air Method
  • Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
  • Procedure 4.1.3, Surface Solder Removal – Braid Method
  • Procedure 5.3.1, Chip Installation – Solder Paste Method/Hot Air Pencil
  • Procedure 5.3.2, Chip Installation – Point to Point

Module 6 Workmanship – Gull Wing Lead Components

The basic basic and additional workmanship skills required for making Gull Wing Lead Components are contained in this additional knowledge module.

  • Procedure 3.5.1, SOT Removal – Flux Application Method
  • Procedure 3.5.2, SOT Removal – Flux Application Method –Tweezer
  • Procedure 3.5.3, SOT Removal – Hot Air Pencil
  • Procedure 3.6.2, Gull Wing Removal (two-sided) – Solder wrap Method
  • Procedure 3.6.6, Gull Wing Removal (two-sided) – Tweezer
  • Procedure 3.7.1.1, Gull Wing Removal (four-sided) – Bridge Fill Method – Surface Tension
  • Procedure 3.7.7, Gull Wing Removal (four-sided) – Hot Gas
  • Procedure 3.7.1, Gull Wing Removal (four-sided) – Bridge Fill Method
  • Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
  • Procedure 4.1.2, Surface Mount Land Preparation – Continuous Method
  • Procedure 4.1.3, Surface Solder Removal – Braid Method
  • Procedure 4.4.1, Cleaning SMT Lands – Using Blade Tip and Solder Braid
  • Procedure 4.2.1, Pad Releveling – Using Blade Tip
  • Procedure 4.3.1, SMT Land Tinning – Using the Blade Tip
  • Procedure 5.5.1, Gull Wing Installation – Multi-Lead Method – Top of Lead
  • Procedure 5.5.3, Gull Wing Installation – Point-to-Point Method
  • Procedure 5.5.4, Gull Wing Installation – Hot Air Pencil/Solder Paste Method

Module 7 Workmanship – J-Lead Components

This basic and additional knowledge module provides the foundation skills for the workmanship of J-Lead Components.

  • Procedure 3.8.1.1, J-Lead Removal – Bridge Fill Method – Surface Tension
  • Procedure 3.8.2, J-Lead Removal – Solder Wrap Method – Tweezer
  • Procedure 3.8.3, J-Lead Removal Flux Application Method – Tweezer
  • Procedure 3.8.4, J-Lead Removal – Flux & Tin Tip Only
  • Procedure 3.8.5, J-Lead Removal – Hot Gas Reflow System
  • Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
  • Procedure 4.1.2, Surface Mount Land Preparation – Continuous Method
  • Procedure 4.1.3, Surface Solder Removal, Braid Method
  • Procedure 5.6.1, J-Lead Installation – Solder Wire Method
  • Procedure 5.6.2, J-Lead Installation – Point-to-Point
  • Procedure 5.6.3, J-Lead Installation – Solder Paste/Hot Air

Module 9 Workmanship – Laminate Repair

The basic and additional skills required for Laminate Repair are contained in this additional knowledge module.

  • Procedure 3.3.1, Hole Repair, Epoxy Method
  • Procedure 3.3.2 Hole Repair, Transplant Method
  • Procedure 3.5.1, Base Material Repair, Epoxy Method
  • Procedure 2.6, Epoxy Mixing and Handling

Module 10 Workmanship – Circuit Repair

The basic and additional knowledge module provides the necessary knowledge for Circuit Repair workmanship.

  • Procedure 4.2.1, Conductor Repair, Foil Jumper Epoxy Method
  • Procedure 4.2.2, Conductor Repair, Foil Jumper, Film Adhesive Method
  • Procedure 4.7.1, Surface Mount Pad Repair, Epoxy Method
  • Procedure 5.1, Plated Hole Repair, No Inner Layer Connection
  • Procedure 6.1, Jumper Wires
  • Procedure 2.6, Epoxy Mixing and Handling

Training:

On-Site training

If you want to reduce the time spent away from the office, traveling, and the cost of sending people to the class, On-Site Training may be for you. But, this might only be cost-effective for several people. We are not limited to just one type of training, at Ectrotec Training we have both on-site and training centers. For more information on student quantity and material discounts, please contact our business support team.

Discounted Offer

If you have at least five people or want to bring in an open enrollment class in your region or country, Please Contact our Business Support Team for a personal discount. And you will surely be receiving some freebies.

Who we are

EctroTech is one of the largest training centres for the electronics industry in Europe, providing technical training and support for the manufacturing industry to quality people with quality that’s unbeatable. Our clients operate across various industries, including telecommunications, saleable electronics, automotive, protection and security, automotive, railroad, aviation and space, oil and gas, medical, life support, and more. With over more than 25+ years of experience in the manufacturing, testing, and quality inspection of various high ticket industries like Military, Medical, Aerospace, Aircraft, and Commercial electronics and more. From inspection services to ESD services, consultancy, training services and more, we have a wide range of products and services.Content-based open courses are not only customisable, but also engaging and informative. Customised training, on the other hand, are specifically designed to meet your learning demands. The recognition of the training is also high, so the effect will be optimal. We provide training materials, knowledge/skill assessments, solder training kits, IPC materials, and more to help your manufacturing operations succeed.